Assistive TechnologyComputer Hardware

AMD Showcases Its “Helios” Rack-Scale Platform Featuring Next-Gen EPYC CPUs & Instinct GPUs; Ready to Target NVIDIA’s Dominance

AMD has unveiled its Helios rack-scale platform at the Open Compute Project, featuring next-generation EPYC CPUs and Instinct GPUs. The platform leverages open standards and liquid cooling to compete with NVIDIA’s AI solutions.

AMD’s Helios Platform Targets AI Dominance

AMD has showcased its groundbreaking Helios rack-scale platform at the Open Compute Project (OCP), marking a significant step in its strategy to challenge industry leaders. The platform combines next-generation EPYC CPUs and Instinct GPUs in an open architecture designed for advanced AI workloads. This move positions AMD directly against competitors like NVIDIA, leveraging open standards to drive innovation in artificial intelligence infrastructure.

AI AnalyticsComputer Hardware

OpenAI Broadcom Partnership: Custom AI Chips for Future Models

OpenAI has officially partnered with semiconductor giant Broadcom to co-develop custom AI chips designed for future AI models. The collaboration aims to reduce dependency on Nvidia while improving performance and efficiency for large language models. First systems are planned for 2026 with wider rollout by 2029.

OpenAI Broadcom Partnership for Custom AI Chips

OpenAI has officially partnered with semiconductor giant Broadcom to co-develop custom AI chips designed to supercharge its next generation of large language models. This strategic move goes far beyond just making results appear faster, as OpenAI aims to gain control over the hardware that powers AI, reduce dependency on Nvidia, and build the foundation for the technology that drives the next generation of AI capabilities.

BusinessSemiconductors

Renesas Unit Sale: $2B Data Center and 5G Timing Components Division on the Market

** Renesas is reportedly considering selling its timing components division, which supplies critical parts for data centers and 5G infrastructure. The potential $2B deal emerges as NVIDIA’s DGX Spark, hailed by Elon Musk, redefines AI computing efficiency with Grace Blackwell architecture. **CONTENT:**

Renesas Electronics is exploring a strategic sale of its timing components unit, which supplies essential parts for data centers and 5G networks, in a transaction that could value the division at approximately $2 billion. This move highlights the shifting dynamics in semiconductor markets, where companies are streamlining portfolios to focus on core growth areas. The timing components segment provides critical clock and synchronization solutions that ensure reliable performance in high-speed computing and telecommunications infrastructure.

AI AnalyticsBusiness SoftwarePartnerships

Salesforce Expands OpenAI and Anthropic AI Partnerships in Agentforce 360 Integration

Salesforce is expanding its strategic AI partnerships with OpenAI and Anthropic to integrate their advanced models directly into Agentforce 360. The enhanced collaboration will enable customers to access these AI capabilities through ChatGPT interfaces. This development coincides with NVIDIA’s announcement of DGX Spark, the world’s smallest AI supercomputer.

Salesforce is significantly expanding its artificial intelligence partnerships with both OpenAI and Anthropic to embed their advanced AI models directly into the Agentforce 360 platform. The strategic enhancement will enable customers to access these powerful AI capabilities through ChatGPT interfaces, marking a substantial evolution in enterprise AI accessibility and functionality.

Salesforce AI Partnership Expansion Details

AI AnalyticsSemiconductors

OpenAI Broadcom Partnership Drives AI Chip Innovation and Stock Surge

OpenAI partners with Broadcom to develop custom AI processors, aiming for 10 gigawatts of computing capacity. The announcement drove Broadcom shares up 11% as investors anticipate massive revenue potential from the AI hardware collaboration.

OpenAI has entered a groundbreaking agreement with semiconductor giant Broadcom to co-develop custom AI processors, sending Broadcom shares soaring as much as 11% in Monday trading. The strategic partnership aims to deploy 10 gigawatts of AI data center capacity, with server racks containing the specialized hardware beginning deployment in late 2026 and full rollout completion targeted for 2029.

Strategic Collaboration Details