Microsoft Unveils Next-Gen HXU That Doubles Cooling Power for AI Data Centers
Microsoft Unveils Next-Gen HXU That Doubles Cooling Power for AI Data Centers Microsoft is tackling one of the biggest challenges…
Microsoft Unveils Next-Gen HXU That Doubles Cooling Power for AI Data Centers Microsoft is tackling one of the biggest challenges…
AMD has unveiled its Helios rack-scale platform at the Open Compute Project, featuring next-generation EPYC CPUs and Instinct GPUs. The platform leverages open standards and liquid cooling to compete with NVIDIA’s AI solutions.
AMD has showcased its groundbreaking Helios rack-scale platform at the Open Compute Project (OCP), marking a significant step in its strategy to challenge industry leaders. The platform combines next-generation EPYC CPUs and Instinct GPUs in an open architecture designed for advanced AI workloads. This move positions AMD directly against competitors like NVIDIA, leveraging open standards to drive innovation in artificial intelligence infrastructure.
Accelsius MR250 CDU Liquid Cooling System Now Generally Available Accelsius, a leader in two-phase direct-to-chip liquid cooling technology, has announced…
As AI workloads push rack densities beyond 100kW, traditional cooling methods are failing. Rack-level containment emerges as the critical solution, enabling ultra-high-density cooling without facility redesigns. This approach supports hybrid architectures and accelerates AI deployment.
Rack-level containment is rapidly becoming the cornerstone of modern AI infrastructure, addressing the unprecedented thermal challenges posed by generative AI workloads. As data centers confront rack densities exceeding 100kW and heading toward 1MW, traditional air cooling systems are proving inadequate. This evolution represents a fundamental shift in how we approach data center design, moving from room-level to rack-level thermal management strategies that can support tomorrow’s AI supercomputers starting today.