Assistive TechnologyComputer Hardware

AMD Showcases Its “Helios” Rack-Scale Platform Featuring Next-Gen EPYC CPUs & Instinct GPUs; Ready to Target NVIDIA’s Dominance

AMD has unveiled its Helios rack-scale platform at the Open Compute Project, featuring next-generation EPYC CPUs and Instinct GPUs. The platform leverages open standards and liquid cooling to compete with NVIDIA’s AI solutions.

AMD’s Helios Platform Targets AI Dominance

AMD has showcased its groundbreaking Helios rack-scale platform at the Open Compute Project (OCP), marking a significant step in its strategy to challenge industry leaders. The platform combines next-generation EPYC CPUs and Instinct GPUs in an open architecture designed for advanced AI workloads. This move positions AMD directly against competitors like NVIDIA, leveraging open standards to drive innovation in artificial intelligence infrastructure.

AI AnalyticsInfrastructure

Rack-Level Containment: The Future of AI Infrastructure Cooling

As AI workloads push rack densities beyond 100kW, traditional cooling methods are failing. Rack-level containment emerges as the critical solution, enabling ultra-high-density cooling without facility redesigns. This approach supports hybrid architectures and accelerates AI deployment.

Rack-level containment is rapidly becoming the cornerstone of modern AI infrastructure, addressing the unprecedented thermal challenges posed by generative AI workloads. As data centers confront rack densities exceeding 100kW and heading toward 1MW, traditional air cooling systems are proving inadequate. This evolution represents a fundamental shift in how we approach data center design, moving from room-level to rack-level thermal management strategies that can support tomorrow’s AI supercomputers starting today.

The AI Density Revolution Transforming Data Centers