AI AnalyticsSemiconductors

AMD Gains Oracle Partnership in AI Chip Market Expansion

Oracle will deploy 50,000 AMD Instinct MI450 GPUs across its data centers starting 2026. This partnership follows AMD’s recent multi-billion dollar OpenAI agreement, signaling growing competition in the AI chip sector against market leader Nvidia.

In a significant development for the AI chip wars, AMD has secured another major partnership, this time with enterprise cloud giant Oracle Corporation, marking continued momentum for the chipmaker against dominant player Nvidia. The companies announced Tuesday that AMD will deploy 50,000 of its most advanced artificial intelligence chips within Oracle’s cloud infrastructure beginning in the second half of 2026.

Oracle-AMD AI Infrastructure Partnership Details

Assistive TechnologyEnergy

Bloom Energy Fuel Cells Power AI Data Centers in $5B Brookfield Deal

Bloom Energy shares soared more than 30% following a landmark $5 billion agreement with Brookfield to provide fuel cell technology for artificial intelligence data centers. The deal represents a major shift toward off-grid power solutions for the rapidly expanding AI industry. This partnership addresses growing concerns about grid capacity and electricity costs facing data center operators.

Bloom Energy shares surged more than 30% in early trading Monday after announcing a transformative $5 billion agreement with Brookfield to deploy fuel cell technology for artificial intelligence data centers. This landmark partnership represents one of the largest private investments in alternative power solutions for the rapidly expanding AI infrastructure sector, addressing critical energy demands that traditional power grids struggle to meet.

Fuel Cell Technology Meets AI Power Demands

AI AnalyticsInfrastructure

Rack-Level Containment: The Future of AI Infrastructure Cooling

As AI workloads push rack densities beyond 100kW, traditional cooling methods are failing. Rack-level containment emerges as the critical solution, enabling ultra-high-density cooling without facility redesigns. This approach supports hybrid architectures and accelerates AI deployment.

Rack-level containment is rapidly becoming the cornerstone of modern AI infrastructure, addressing the unprecedented thermal challenges posed by generative AI workloads. As data centers confront rack densities exceeding 100kW and heading toward 1MW, traditional air cooling systems are proving inadequate. This evolution represents a fundamental shift in how we approach data center design, moving from room-level to rack-level thermal management strategies that can support tomorrow’s AI supercomputers starting today.

The AI Density Revolution Transforming Data Centers